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Evonik at Labelexpo Asia 2011
Evonik at Labelexpo Asia 2011


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Evonik showcase its innovative products and solutions for the customers of label industry

Booth Information:
Labelexpo Asia 2011(Shanghai New International Expo Center)
Time: Nov 29 to Dec 2,2011
Booth number: Hall E2/J20
Look forward to meeting you at the Evonik Booth of Labelexpo Asia 2011

The Labelexpo Asia 2011 will be held in Shanghai, China from November 29th to December 2nd, 2011. During the upcoming Labelexpo in Shanghai, Evonik will promote the environmentally friendly qualities of its UV-curable silicones, highlighting the energy and cost saving benefits.
The label industry has seen recent and rising interest in several areas; among them are the uses of thinner & recyclable filmic materials (such as 30µ BOPP film), linerless labels, in-line narrow web production. This trend has been very evident in Europe, US, as well in China. Evonik’s TEGO® RC silicones provide a perfect synergy for siliconizing 30µ BOPP film, who not only has a low carbon footprint compared to other liners, but also are 100 percent recyclable. Due to the cold curing and lack of post curing of TEGO® RC silicones, it also enables to produce the labelstock (include linerless labels) in-line using hot melts, UV adhesives.
Evonik acknowledges the sustainability and recyclability demands of the industry, as well as the drive to find lower cost products. TEGO® RC silicones are completely in line with these demands. Evonik’s global presence and availability of technical centers with pilot plants in China, Europe and the US provides active co-operation with our customers and all members of the value chain, playing a key role in understanding market needs and further success.

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